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  • Basics Fashion Design 09: Designing Accessories

    Exploring the design and construction of bags, shoes, hats and jewellery

    de John Lau ...
    Series series Basics Fashion Design
    Long since regarded as an inessential object that simply adds to the beauty, convenience or effectiveness of an outfit, accessories are now considered key items in a fashion collection and as stand-alone pieces worthy of our undivided attention. Basics Fashion Design 09: Designing Accessories is filled with important information that any designer will need to know, examining four key items from ... Leer más

    $29.99 USD

  • Strategies for a Successful Retirement: Before, During, & After

    de John Lau ...
    Preparation is the key to success in every stage of life, from grade school to college to entering the work force to marriage, and to retirement. The level of success depends largely on how well you prepare for the journey. This book is written to help retirees strategize and make the right choices in each phase of retirement – Before, During & After.The first four chapters of the book are written ... Leer más

    $5.00 USD o gratis con Kobo Plus

  • Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

    Series series Engineering (R0)
    This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu ... Leer más

    $197.99 USD

  • Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

    Series series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates ... Leer más

    $170.99 USD

  • A Race Between Time and Money: Strategies for a Successful Retirement

    Preparation is key to success in every stage of life, and retirement is no exception. Whether it’s a complete financial overhaul or a simple check-up, this book aims to illuminate the financial issues common in retirement with simple and concise language. Covering topics like Social Security, your 401(k), healthcare, investing, and more, retirement peace of mind starts with knowing where you stand ... Leer más

    $6.99 USD

  • Semiconductor Advanced Packaging

    de John H. Lau ...
    Series series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, ... Leer más

    $116.99 USD

  • Through-Silicon Vias for 3D Integration

    de John H. Lau ...
    A comprehensive guide to TSV and other enabling technologies for 3D integrationWritten by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low ... Leer más

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  • Emperor John II Komnenos

    Rebuilding New Rome 1118-1143

    Series series Oxford Studies in Byzantium
    John II Komnenos was born into an empire on the brink of destruction, with his father Alexios barely preserving the empire in the face of civil wars and invasions. A hostage to crusaders as a child, married to a Hungarian princess as a teenager to win his father an alliance, and leading his own campaigns when his father died, it was left to John to try and rebuild the empire all but lost in the ... Leer más

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  • Karl Barth and Comparative Theology

    Series Libro 7 - Comparative Theology: Thinking Across Traditions
    Building on recent engagements with Barth in the area of theologies of religion, Karl Barth and Comparative Theology inaugurates a new conversation between Barth’s theology and comparative theology. Each essay brings Barth into conversation with theological claims from other religious traditions for the purpose of modeling deep learning across religious borders from a Barthian perspective. For ... Leer más

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  • The Hodder Bible Commentary: 1 & 2 Chronicles

    Series series Hodder Bible Commentary
    Far from being a dusty historical appendix, Chronicles is a theological compass, pointing a weary people back to hope in God's promises. It's a retelling of Israel's past with a purpose: to reawaken worship, renew identity and rekindle trust in the God who keeps his covenant, even after catastrophe.In this accessible and rich commentary, Peter Lau explores Chronicles as a work of careful literary ... Leer más

    $13.99 USD

  • Hydrology of the Hawaiian Islands

    Why is groundwater the predominant drinking water source in Hawaii? Why are groundwater sources susceptible to pesticide contamination? How long does it take for water in the mountains to journey by land and underground passages to reach the coast? Answers to questions such as these are essential to understanding the principles of hydrology—the science of the movement, distribution, and quality of ... Leer más

    $35.99 USD

  • Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

    de John H. Lau ...
    Series series Engineering (R0)
    This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, ... Leer más

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