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  • Reliability Technology for Integrated Circuit Packaging

    by Bin Zhou, Yunfei En, Si Chen ...
    Series series Engineering (R0)
    This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to ... Read more

    $161.09 USD