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Showing 1 - 12 of 12 results for “junlei wang”
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  • The 5th International Conference on Vibration and Energy Harvesting Applications (VEH 2024)

    Edited by Lihua Tang, Kean Aw, Guobiao Hu, Junlei Wang ...
    Series series Springer Nature Proceedings excluding Computer Science
    This book presents select proceedings of the 5th International Conference on Vibration and Energy Harvesting Applications (VEH 2024). This book covers latest research and technological advances in the field of vibration analysis, energy harvesting, and its applications. Topics covered in the book include innovative research works related to vibration analysis, energy harvesting, their applications ... Read more

    $296.09 USD

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  • 3d Printing And Additive Manufacturing Of Electronics: Principles And Applications

    by Chee Kai Chua, Wai Yee Yeong, Hong Yee Low, Tuan Tran, Hong Wei Tan ...
    Series Book 3 - World Scientific Series In 3d Printing
    3D printed electronics have captured much attention in recent years, owing to their success in allowing on-demand fabrication of highly-customisable electronics on a wide variety of substrates and conformal surfaces. This textbook helps readers understand and gain valuable insights into 3D printed electronics. It does not require readers to have any prior knowledge on the subject.3D Printing and ... Read more

    $41.39 USD

  • LED Packaging for Lighting Applications

    Design, Manufacturing, and Testing

    by Xiaobing Luo, Shen Liu ...
    Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high ... Read more

    $139.00 USD

  • Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

    by John H. Lau ...
    Series series Engineering (R0)
    This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, ... Read more

    $179.99 USD

  • Proceedings of the International Conference of Fluid Power and Mechatronic Control Engineering (ICFPMCE 2022)

    Edited by Liang Yan, Jing Na ...
    Series series Springer Nature Proceedings excluding Computer Science
    This is an open access book.Since 1985, held 22 times in different cities all over China, ICFPMCE has now been listed in annual academic activities (non-profit) of the Chinese Society of Theoretical and Applied Mechanics (CSTAM), which has become one of the significant conferences in the field of fluid power and mechatronic control engineering.Under the theme of ‘Green Intelligence, Innovative ... Read more

    Free

  • Welding and Related Technologies

    Proceedings of the VIIth International Conference on Welding and Related Technologies (WRT 2024, 7-10 October 2024, Yaremche, Ukraine)

    Edited by Igor Krivtsun, Fuad Khoshnaw, Ganna Polishko, Serhiy Schwab, Roman Selin ...
    Welding and Related Technologies contains the papers presented at the VIIth International Conference on “Welding and Related Technologies” (WRT 2024, Yaremche, Ukraine, 7-10 October 2024). The topics covered include:Innovative Technologies, Materials and Equipment for Welding and Related ProcessesStrength and Stress-Strain States of Welded Joints and StructuresAdditive TechnologiesNew Structural ... Read more

    Free

  • Advances in Frontier Research on Engineering Structures

    Edited by Yang Yang ...
    Series series Engineering (R0)
    This is an open access book. This book focuses on the research of advanced structures and anti-seismic in civil engineering. It features the most cutting-edge research directions and achievements related to civil and structural engineering. Subjects in this book include:·Engineering Structure and Seismic Resistance·Structural Mechanics Analysis·Components and Materials·Structural Seismic Design·3D ... Read more

    Free

  • Advanced MEMS Packaging

    by Yu Aibin, Cheng Kuo Lee, C. S. Premachandran, John H. Lau ...
    A comprehensive guide to 3D MEMS packaging methods and solutionsWritten by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and ... Read more

    $144.99 USD

  • Proceedings of the 6th International Conference on Advanced High Strength Steel and Press Hardening (ICHSU 2022)

    Edited by Yisheng Zhang, Mingtu Ma ...
    Series series Springer Nature Proceedings excluding Computer Science
    This is an open access book.The scope of papers is as follows (including but not limited to):Material and process of low temperature hot stamping (heating temperature 750-800°C)Cold stamping technology of advanced high strength steel 1180-1470MPaTechnology and application of multi-material forming (mixed forming of carbon fiber composites, steel and aluminum)Laser blanking and defect prevention of ... Read more

    Free

  • Printed Batteries

    Materials, Technologies and Applications

    Edited by Senentxu Lanceros-Méndez, Carlos Miguel Costa ...
    Offers the first comprehensive account of this interesting and growing research fieldPrinted Batteries: Materials, Technologies and Applications reviews the current state of the art for printed batteries, discussing the different types and materials, and describing the printing techniques. It addresses the main applications that are being developed for printed batteries as well as the major ... Read more

    $140.00 USD

  • Advanced Flip Chip Packaging

    Edited by Yi-Shao Lai, C.P. Wong, Ho-Ming Tong ...
    Series series Engineering (R0)
    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better ... Read more

    $152.09 USD

  • Theories, Methods and Numerical Technology of Sheet Metal Cold and Hot Forming

    Analysis, Simulation and Engineering Applications

    by Ping Hu, Li-zhong Liu, Yi-guo Zhu, Ning Ma ...
    Series series Engineering (R0)
    Over the last 15 years, the application of innovative steel concepts in the automotive industry has increased steadily. Numerical simulation technology of hot forming of high-strength steel allows engineers to modify the formability of hot forming steel metals and to optimize die design schemes. Theories, Methods and Numerical Technology of Sheet Metal Cold and Hot Forming focuses on hot and cold ... Read more

    $89.09 USD